1 Technical round(written exam based on coordinate geometry, mostly concentrted on 3d geometry) It consists of question varing from medium level to hard level. I was able to attempt all the question and got 13 out of 15 right & I got shortlisted for the interview 2 interview round(Hr ) I specified why I wanted to work in that company & what are the advantages I could make myself and to the company. Interview panel consisted of 3 experienced people where mostly I consider it as strees interview since my cgpa is not too high(confidence is the only tool needed then)